| 摘要 |
PROBLEM TO BE SOLVED: To simultaneously perform manufacture of an injection molding printed-wiring body and connection and injection molding of a wiring body and another circuit base by performing preparation of the injection molding printed-wiring body and formation of an injection-molded body at the connecting part and thereby performing simultaneously connection with another circuit plate. SOLUTION: When a transfer sheet 4 and another circuit base sheet 2 are mounted in a movable mold by means of a positioning pin 35 in such a way that their connecting parts are faced and brought into contact with each other and the mold is closed, the pin 35 is hooked in a pin inserting hole 46 and the transfer sheet 4 and the circuit base sheet 2 are fixed under a condition where their connecting parts are faced with each other. Then, when a molten resin is injected into cavities 33 and 44 for forming a molded body for the connecting parts from a gate 42, the resin flowing into the cavity 33 passes through a communication part and flows into the cavity 44 while it fills the cavity 33 to form the molded body for the connecting parts and to form the other circuit base sheet 2. In addition, the resin is injected simultaneously into a cavity 43 from a gate 41 to form simultaneously a printed-wiring body where a circuit pattern is transferred. |
