发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To obtain a printed circuit board capable of mounting flat package elements and discharging, without providing an exclusive pattern for discharging static electricity. SOLUTION: A pattern structure has a discharging pass space 17 disposed below a chip capacitor 5 and this space 17 is surrounded by the capacitor 5, the lands 12 of a ground pattern 11, the solder 15 to solder the capacitor 5 to the lands 12, 13 and the adhesive agent 16 to fix the capacitor 5 to a printed circuit board.</p>
申请公布号 JPH09232714(A) 申请公布日期 1997.09.05
申请号 JP19960035084 申请日期 1996.02.22
申请人 YAZAKI CORP 发明人 KATO KATSUMI
分类号 H05K3/34;H05K1/02;H05K1/18;H05K3/30;(IPC1-7):H05K1/18 主分类号 H05K3/34
代理机构 代理人
主权项
地址