| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding apparatus capable of stabilizing the bonding load and improving the bonding strength. SOLUTION: This apparatus is furnished with a capillary through which wire is passed, a bonding arm supporting the capillary at its tip, a motor 21 for moving the bonding arm back and forth, a current supplier 26 for supplying driving current to the motor, an encoder 22 for detecting the movement of the bonding arm and outputting pulse signal, a control block for receiving pulse signal and controlling the driving current from the current supplier. The control block has a main controller 23 for outputting a torque command 'a' proportional to the target value of bonding load when the capillary applies bonding load to the bonding face, a sub-controller 27 for receiving the pulse signal and outputting an adjusting command 'b' suppressing vibration of the bonding arm, and an adder 30 for adding the torque command and the adjusting command and outputting the sum to the current supplier. |
