发明名称 |
DEVICE WHICH IS USED SPECIALLY IN ELECTRONIC CONTROL DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To conduct simply a mechanical fixing of a module constitution unit by a method wherein a second group-of-constituent component support body is coupled with a first group-of-constituent component support body via a solder layer. SOLUTION: A first group-of-constituent component support body consists of a printed-wiring sheet 3. This sheet 3 is provided with a polyimide layer 7 covered with copper layers 5 and 6 and this layer 7 is coupled with a metal carrier 9 via a prepreg layer 8. A second group-of-constituent component support body consists of a multilayer substrate provided with copper layers 21 to 24. Polyimide layers 14 to 16 are respectively arranged between the copper layers. A prepreg layer 17 is mounted to the lower part of the copper layer 24, the surface of a copper layer 25 is mounted to the upper part of this layer 17 and the copper layer 25 formes the lower side of the second group-of-constituent component support body. The second support body is finally coupled with the copper layer 25 on the surface of the first support body via a solder layer 40, which is mounted to the lower part of the copper layer 25 in a large area and consists of lead/tin solder layers. |
申请公布号 |
JPH09232711(A) |
申请公布日期 |
1997.09.05 |
申请号 |
JP19970029478 |
申请日期 |
1997.02.14 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
TOOMASU BUIIZA;DEIITAA KARU;RARUFU SHIMITSUEKU |
分类号 |
H05K1/00;H05K1/14;H05K1/18;H05K3/00;H05K3/28;H05K3/34;H05K3/36;(IPC1-7):H05K1/14 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|