| 摘要 |
The solder pot is in the form of a semicylinder (11) closed at its two ends by spherical segments (12), equipped with heating resistances (2) and external ducts or tubes (5). The heating resistances are located against the outer wall of the pot and cover part of the outer semi-cylindrical surface. The external ducts or tubes can also be equipped with their own heating resistances (6), so that the solder alloy is kept at a temperature above its eutectic value. |
