| 摘要 |
PROBLEM TO BE SOLVED: To improve connection strength by improving the fit between a bonding tool and a metallic fine wire, and improving the transmission of the pressure from the bonding tool to a connection, and transmission of ultrasonic vibration. SOLUTION: This wire bonder is used for connecting the connection 2 of a lead frame 8 with a wire 15 electrically by laying the aluminum wire 15 on the connection 2 of the lead frame 8 composed of copper or copper alloy and mounted with electronic part body, and pressing this wire 15 with a bonding tool 16 given ultrasonic vibration. Then, a heating means 17 is added, which heats the wire positioned above the section to be connected of the lead frame 8 and improves the extension property of the wire 15 pressed by the bonding tool 16. |
