| 摘要 |
PROBLEM TO BE SOLVED: To prevent an insulating base substance from being chipped off or split, cracked, etc., by an external force by forming the insulating base substance by uniting an inorganic insulator powder with a thermosetting resin excellent in toughness. SOLUTION: Three insulating base substance sheets 1a, 1b, 1c for constituting an insulating base substance 1 are formed by uniting 60-95wt.% of an inorganic insulator powder with 5-40wt.% of a thermosetting resin. Besides, wiring conductors 2 each consisting of a thermosetting resin and a metallic member made by solder-joining a part of a scaly metal powder are attached to the insulating base substance 1 from the periphery of its recession 1d to its underside surface. Since the three insulating base substance sheets for constituting an insulating base substance 1 are formed by uniting the inorganic insulator powder with a thermosetting resin excellent in toughness, the insulating base substance does not chip off, split, crack, etc., even if wiring boards collide with each other or a wiring board collides with a part of a semiconductor device manufacturing automatic line fiercely.
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