| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve yield by inserting a pedestal of heat-resistant synthetic resin between the lower surface of a carrier and the upper surface of a porous support plate in a furnace so as to prevent occurrence of metal powder between the carrier and the porous support plate in the furnace. SOLUTION: A carrier 1 containing a plurality of semiconductor wafers W comprises a carrier main body 2, a metal side plate 3 and a stay member 4 both connected to the carrier main body 2. The carrier 1 is placed on a metal porous support plate 6 in a furnace so as to heat the semiconductor wafers W. A pedestal member 8c of heat-resistant synthetic resin is inserted between the lower surface of the carrier 1 and the upper surface of the porous support plate 6. This insertion of the pedestal member 8c, the lower surface of the carrier 1 is in direct contact with the upper surface of the support plate 6, which avoids scratching the carrier 1 on the support plate 6. This reliably prevents occurrence of metal powder when placing the carrier 1 on the upper surface of the support plate 6 or removing the carrier 1.</p> |
