| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the product cost and improve the reliability of the product by reducing required area of a metal base board for inteligent power modules(IPM), etc. SOLUTION: A semiconductor device comprises a main circuit block 2 contg. power elements and control circuit block 3 assembled in a resin case combined with a metal base board and input/output main terminals 5 and control terminals 6 distributed on the periphery of the case. The input main terminals 5 and output main terminals 5 of the main circuit are disposed at one and opposite sides of the case and control terminals 6 are disposed at the remaining sides. Holes 8 for mounting setscrews to fix the semiconductor device to a radiation fin are formed between the opposed sides, the main circuit block 2 is mounted on a limited main circuit mounting area of the base board 1, including the holes 8, and the control circuit block 2 is separated from the board 1 and mounted on the bottom of the case 4.</p> |
