| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a structure, wherein increase in a capacitance is further expected in proportion to the increase in a relative permittivity, of a printed- wiring board to obtain more reduction in a power supply side impedance. SOLUTION: This printed-wiring board is formed into a structure, wherein component surface patterns 1 and soldered surface patterns 2 are arranged on the upper and lower surfaces of low-permittivity resin insulating layers 3 or the pattern 1 and the pattern 2 are arranged on one surface of each layer 3, these patterns 1 and 2 are respectively bonded to the low-permittivity resin insulating layers 3 to form transmission lines, through which a high-speed signal is flowed, grounding layers 4 and power players 5 or layers, which partially comprise a signal pattern, are arranged between these layers 3 and high- permittivity inorganic insulating layers 7 are respectively formed between the layers 4 and the layers 5.</p> |
