| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a work film which is excellent in the improvement of accuracy in alignment and superior in workability at the time of placing the work film on the surface of a photosensitive insulating layer and subjecting the film to exposure, and a process for producing a multilayered printed circuit board using the same work film. SOLUTION: The work film (photomask film) on which position frames 2 enclosing position marks 3 and reference frames 4 enclosing the reference marks 5 adjacent thereto are formed and in which the annular reference marks 5 is made larger than the position marks 3, is used, thereby, the position marks 3 and position frames 2 of the work film (photomask film) are superposed on the reference marks 5 and reference frames 4 formed on a substrate 11, a first adhesive layer 15, a plating resist 16, etc.</p> |
