发明名称 |
WIRING BOARD MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To prevent an insulation board having wiring conductors from being broken or cracked by an applied external force. SOLUTION: Precursor sheets 11a-11c for an insulation board are made of a thermosetting resin precursor mixed with an inorg. insulation powder. Metal paste 12 composed of a thermosetting resin precursor mixed with a Cu or Ag powder coated with a low m.p. metal of 300 deg.C or less in m.p. to form wiring conductors is printed into specified patterns on the sheets 11a-11c. The printed sheets 11a-11c are heat treated to bond the Cu or Ag powder with the low m.p. metal and thermally harden the thermosetting resin precursors of the sheets 11a-11c and paste 12.
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申请公布号 |
JPH09232727(A) |
申请公布日期 |
1997.09.05 |
申请号 |
JP19960036080 |
申请日期 |
1996.02.23 |
申请人 |
KYOCERA CORP |
发明人 |
KATORI NAOHIRO;MATSUO SHOGO;SEKIOKA YOICHI |
分类号 |
H05K1/09;H01L23/12;H01L23/14;H01L23/15;H05K1/03;H05K3/00;H05K3/12;(IPC1-7):H05K3/12 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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