发明名称 WIRING BOARD MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent an insulation board having wiring conductors from being broken or cracked by an applied external force. SOLUTION: Precursor sheets 11a-11c for an insulation board are made of a thermosetting resin precursor mixed with an inorg. insulation powder. Metal paste 12 composed of a thermosetting resin precursor mixed with a Cu or Ag powder coated with a low m.p. metal of 300 deg.C or less in m.p. to form wiring conductors is printed into specified patterns on the sheets 11a-11c. The printed sheets 11a-11c are heat treated to bond the Cu or Ag powder with the low m.p. metal and thermally harden the thermosetting resin precursors of the sheets 11a-11c and paste 12.
申请公布号 JPH09232727(A) 申请公布日期 1997.09.05
申请号 JP19960036080 申请日期 1996.02.23
申请人 KYOCERA CORP 发明人 KATORI NAOHIRO;MATSUO SHOGO;SEKIOKA YOICHI
分类号 H05K1/09;H01L23/12;H01L23/14;H01L23/15;H05K1/03;H05K3/00;H05K3/12;(IPC1-7):H05K3/12 主分类号 H05K1/09
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