| 摘要 |
PROBLEM TO BE SOLVED: To feed solder material uniformly and simply at low cost in a fluxless way, which does not require a cleaning process, by a method wherein the solder materials and soldered parts, which consist of each electrode, are covered using a liquid, which is vaporized after the connection of the electrodes with the electronic component or the circuit board is completed. SOLUTION: Solder balls 1 are first shaken in an arrangement jig 2 while vibrations are given to the jig 2. Then, a liquid 4, which is vaporized after the connection between an electronic component or a board 3 and electrodes 3a, is applied on the electronic component or the board 3 in a degree that the surfaces of the electrodes 3a and the balls 1 are covered with the liquid 4. After the balls 1 are made to invert as the jig 2 is evacuated to a vacuum state and are aligned with the electrodes 3a to correspond to the balls 1, the balls 1 are mounted on the electrodes 3a. After that, the temperature of the liquid 4 becomes the melting temperature of solder. At this time, each surface oxide film on the surfaces of the electrodes 3a is broken by the volume expansion of the balls 1 due to fusion of the balls 1. On the other hand, as the surfaces of the electrodes 3a are covered with the liquid 4, the newly appeared surfaces of the fused balls 1 come into contact with the surfaces of the electrodes 3a to wet- sparred. After that, the evacuation to a vacuum state is stopped to separate the jig 2 from the balls 1. |
