CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a circuit board having many terminal bumps as external connection terminals the heights of which can be made equal as much as possible, the bumps each being composed of a resin-made protrudent member and formed at one end opening of a through-hole piercing the board. SOLUTION: A circuit board has a conductor pattern 18 formed on one face of a resin board 10 and terminal bumps 30 formed as external connection terminals electrically connected to the pattern 18 on the other face of the board. The bumps 30 are electrically connected to the pattern 18 and composed of members 20 integrated with the board 10 so as to protrude hemispherically from the other face of the board 10 and metal layer 22 covering the surface of the members 20 and electrically connected to the pattern 18 by through-holes 16 composed of holes 12 piercing the board 10. One end of each hole 12 is opened at near the center of the member 20. A metal layer 14 is formed on the inner wall of the hole 12.