| 摘要 |
<p>PROBLEM TO BE SOLVED: To align with high accuracy a terminal for external connection with a contact of a measuring jig when a many-pin and narrow-pitch semiconductor device is tested, to surely connect them electrically, to prevent a contact defect and a function defect such as an open defect or the like from being generated and to enhance the yield of the semiconductor device. SOLUTION: Metal protrusions 3a, for alignment, which are formed at a semiconductor chip 2a are dropped into insertion holes 10a in a contact substrate 8a at a carrier 4a for measurement. Terminals (electrode pads 1a) for external connection at the semiconductor chip 2a are aligned with contact terminals 6a, at the contact substrate 8a, which correspond to them. The semiconductor chip is mounted on a socket. After that, an electric test and a burn-in test are made. Thereby, the electrode pads 1a and the contact terminals 6a are aligned with high accuracy so as to be electrically connected surely, it is possible to prevent a contact defect and a function defect from being generated, and the yield of a semiconductor device is enhanced.</p> |
