| 摘要 |
PROBLEM TO BE SOLVED: To inhibit the generation of warpage, to increase heat resistance and to enhance the reliable connection between circuits on insulating layers through non-through holes in a multilayered circuit board of a structure, wherein the connection between the circuits on the insulating layers is made through the non-through holes and a high-density wiring is provided. SOLUTION: In a method, wherein circuits are piled up on both surface or one surface of a core material printed-wiring board 1 via insulative layers 10 and 11 and the connection between36m or smaller.) is made to contain in the layers 10 and 11 to make a plating adhere uniformly to the wall surfaces of the holes 4 and 6. Moreover, the diameter of a glass fiber constituting the nonwoven glass faber is set in a diameter of 13μm or smaller to make glass, which is molten by the laser irradiation, hardly turn into recesses and projections on the wall surfaces of the holes at the time of the formation of the holes 4 and 6. |
