| 摘要 |
PROBLEM TO BE SOLVED: To prevent a layer structure of a printed interconnection board from being thick by plating and facilitate forming a fine circuit pattern. SOLUTION: Panel plating of chemical Cu is applied to the entire surface of a laminate 60 having holes 110 for throughholes 10 and holes 21, 31 for IVHs(inner via holes) 20, 30 to form a chemical Cu plated layer 50. Except parts for forming through-hole lands 12, 13 and IVH lands 22, 32, it is masked with a dry film and electrolytically plated to form an electrolytic plated layer 40. The film is removed and etching is applied to form a conductor circuit 51, through-hole lands 12, 13 and IVH lands 22, 32. |
