| 摘要 |
PROBLEM TO BE SOLVED: To reduce occurrence of particles in a substrate processing device. SOLUTION: This device is provided with a substrate rotating/holding mechanism 100 which rotates a substrate while holding it, rotary substrate processing parts 4, 7 and 8 which, while rotating the substrate W, perform a specified substrate processing, a substrate carry in/out unit 22 which performs carrying in/out the substrate W of a device 1, a substrate transportation unit 3 which transports the substrate W in the device I, etc. In this case, the substrate rotating/holding mechanism 100 is provided with an orthogonal supporting part VO which supports the lower surface of the substrate W in point contact and a horizontal supporting part HH which contacts to the outside periphery of the substrate W and regulates the horizontal position of the substrate W, and the substrate carry in/out unit 22 and the substrate transportation unit 3 are provided with an orthogonal supporting part VO which supports the lower surface of the substrate W in point contact and horizontal regulating part HC which regulates horizontal movement of the substrate W. |
