| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of wire bonding by which the displacement can be quickly detected and the productivity is enhanced. SOLUTION: Taking by camera an image of a semiconductor pellet 7 and the leads 8a surrounding the pellet 7, implementing individually image processing of the detected area a1, a2, b1, b2, b3, and so on defined in the image S picked up by camera, the displacements of electrodes 7a and leads 8a on the semiconductor pellet 7 are obtained. |
