发明名称 BRUSHLESS MOTOR
摘要 PROBLEM TO BE SOLVED: To dissipate the heat generated by a motor driving IC with a simple structure of high quality at low cost, when a brushless motor is rotated at high speed. SOLUTION: When a motor driving IC 10, a resistor 11 and a capacitor 12 are mounted on a metal-based printed circuit board 1, a thermally conductive material 20 is put into the space between the IC 10 and the metal-based printed circuit board 1. Then, by foaming a zigzag land 22 and applying solder paste 23 on the GND pattern of a control circuit part provided on the metal-based printed circuit board 1, heat generated by the motor driving IC 10 is transferred directly to copper foil on the metal-based printed circuit board 1 via the thermal conductive material 20. By improving the heat dissipation effect with the solder paste 23 applied to the metal-based printed circuit board 1, this motor of simple structure of high quality having high heat dissipation effect is obtained at low cost.
申请公布号 JPH09233796(A) 申请公布日期 1997.09.05
申请号 JP19960037695 申请日期 1996.02.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUMOTO TOSHIAKI;YOSHITSUGU TAKAO;OHATA KOICHIRO
分类号 H02K29/00;H02K9/22;H05K1/02;H05K3/34;(IPC1-7):H02K29/00 主分类号 H02K29/00
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