| 摘要 |
PROBLEM TO BE SOLVED: To enlarge the degree of freedom on production adjustment and to improve capital investment efficiency by making the die bonding device of a semiconductor device to correspond to two kinds of standard structure package and LOC(lead on chip) structure package. SOLUTION: A lead frame deals with a first lead frame where paste-like adhesive is applied to a pellet mounting part 5a and a semiconductor element is die-bonded and a second lead frame where organic resin adhesive which is previously applied to the insulating material 5b of the pellet mounting part 5a is heated and fused and the semiconductor element is bonded in common. A lead frame carrier mechanism A avoids the pellet mounting part 5a on which the semiconductor element is mounted, supports the side edge of the lead frame and executes pitch-feeding. A die bonding mechanism by paste-like adhesive and a die bonding mechanism by organic resin adhesive are detached and installed above and below the lead frame carried in a horizontal attitude. |
