| 摘要 |
<p>PURPOSE:To prevent connection failure when mounting circuit parts by cladding and forming a metal layer with an improved corrosion property on a surface of a circuit wiring pattern and then forming a hole for continuity reaching the circuit wiring pattern by emitting excima laser from an opposite side. CONSTITUTION:A metal mask 3 has a hole 4 at a position where a circuit wiring pattern 2 is positioned and at the same time a groove hole for separation 5 is provided along an outer shape of a product. A metal layer 6 with an improved corrosion resistance is formed on a surface of the circuit wiring pattern 2 by plating, etc., and then a protection film 8 is applied onto it using an adhesive 7. An excima laser light A is emitted from a side of the metal mask 3 for forming a hole for continuity 10 and a separation groove 5A. When eliminating etching of the metal mask 3, conduction in the bottom part of the hole for continuity 10 cannot be lost due to presence of the metal layer 6 and one edge is electrically joined to the circuit wiring pattern 2 and at the same time a pad for connection of circuit parts such as an IC which protrudes outside of an insulation base material 1 or a bump 11 can be formed at the other edge.</p> |
