发明名称 |
Low temperature glass paste with high metal to glass ratio |
摘要 |
A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis: about 40-65% Ag2O about 15-35% V2O5 about 0-30% PbO2 about 0-20% TeO2 The essentially resin-free paste utilizes the glass composition described above and, for a metallized ceramic substrate, has a metal:glass ratio of from about 8:1 up to about 11.5:1. For a bare (nonmetallized) ceramic substrate, the paste has a metal:glass ratio of from about 8:1 up to about 32:1.
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申请公布号 |
US5663109(A) |
申请公布日期 |
1997.09.02 |
申请号 |
US19960654852 |
申请日期 |
1996.05.29 |
申请人 |
QUANTUM MATERIALS, INC. |
发明人 |
DIETZ, RAYMOND L.;PECK, DAVID M. |
分类号 |
C03C3/12;C03C8/14;C03C8/18;C03C8/24;(IPC1-7):C03C3/12 |
主分类号 |
C03C3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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