| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface where the irregularity of polishing is little and the in-plane uniformity of flatting is excellent by finely supplying polishing liquid onto the surface of a wafer in the case where a polishing pad rotatingly polishes a workpiece as it reciprocates along the surface of a polished object such as the wafer. SOLUTION: A polishing unit has a table 6 to rotatably hold a wafer 2; a polishing pad 8 which is rotatably held and discharges polishing liquid from a rotation center part; a reciprocating mechanism for relatively reciprocating the rotating polishing pad 8 along the surface of the wafer 2 in the radius direction of the wafer 2; and a rectification plate 21 for turning the polishing liquid discharged from the central part of the polishing pad 8 toward the surface of the wafer 2 in a state where the central part of the polishing pad 8 is off from the wafer 2. |
