发明名称 PHOTOCURABLE RESIN COMPOSITION EXCELLENT IN HEAT RESISTANCE
摘要 PROBLEM TO BE SOLVED: To obtain a photocurable resin compsn. which can provided a three- dimensional molding having a low vol. shrinkage and an excellent dimensional stability, a high heat distortion temp. and an excellent heat resistance, and excellent clarity and mechanical characteristics. SOLUTION: This compsn. contains a urethanized acrylic compd represented by the formula [wherein R<1> is H or CH3 ; (p) is 1 or 2 provided when (p) is 2, then at least one of R<1> 's is CH3 ; A is a diol or triol residue; D is a di- or trivalent hydrocarbon group; E is a (poly)ethylene oxide residue and/or a (poly) propylene oxide residue comprising 1-4 alkylene oxide units; R<2> is H or alkyl; (q) is 1 or 2; and (r) is 3 or 4], another free-radical-polymerizable compd. in a wt. ratio to the urethanized acrylic compd. of (20:80)-(90:10), a photopolymn. initiator, and if necessary, fine solid particles and/or a whisker.
申请公布号 JPH09227640(A) 申请公布日期 1997.09.02
申请号 JP19960116939 申请日期 1996.04.15
申请人 TEIJIN SEIKI CO LTD 发明人 TAMURA JUNICHI;HAGIWARA TSUNEO
分类号 C08F290/06;B29C67/00;B29K96/00;C08F20/36;C08G18/67;(IPC1-7):C08F290/06 主分类号 C08F290/06
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