LINEAR CONDITIONER DEVICE FOR CHEMICAL MECHANICAL POLISHING SYSTEM

摘要

PROBLEM TO BE SOLVED: To optimize the throughput and flatness of polishing and to minimize contamination and destruction of substrate by forming a polishing surface on a polishing pad to be in contact along a linear segment extending to the vicinity of polishing pad from the edge thereof. SOLUTION: In a polishing device 80 a polishing station 100 (100a-100c) and a transfer station 105 are supported to a table top 83. Each polishing station 100 has a platen 110 on which a polishing pad 120 is placed and a pad conditioner 130. Above a mechanical base 82 a carrousel having a carrier head system 160 (160a-160d) is arranged. Every time when a substrate is polished the conditioner 130 moves reciplocally between the center and the outer edge of the pad 120 to thereby sweep a conditioner head 134 to the whole surface of the pad 120, leading to the recycle thereof.