Process for producing multilayer wiring boards

摘要

An improved process for producing a multilayer wiring board that has a plurality of conductor patterns (2) and an interlevel dielectric layer (3) on at least one surface of a substrate (1), with via holes (5) or trench-like channels (8) being provided at specified sites of said interlevel dielectric layer (3) to establish an electrical interconnection between said conductor patterns (2), characterized in that prior to the provision of said via holes (5) or trench-like channels (8), a coating (4) having resistance to sandblasting is formed in a pattern over the interlevel dielectric layer (3) and then sandblasting is performed to remove the interlevel dielectric layer (3) in selected areas to form the via holes (5) or trench-like channels (8) and, thereafter, the coating (4) having resistance to sandblasting is removed, followed by the provision of a conductive layer (7).