| 摘要 |
PROBLEM TO BE SOLVED: To provide a chamfering method by which the ridge part of a cut or divided glass substrate can be worked cleanly with high productivity without necessitating a washing process and without impairing the flatness precision on the polishing plane of the glass substrate. SOLUTION: Laser beams 2 are converged by a condensing lens 5 and emitted locally near the ridge of a glass substrate 1, at the position outside the focal position 3 of the converged laser beam, as a laser beam 4 having a diameter larger than that of the focal position 3. With the heat by the irradiation of the laser beam 4, and consequentially with a thermal stress incident to a local thermal expansion, a crack 11 is caused to the glass substrate 1; then, the crack 11 successively caused on the glass substrate 1 is made to grow continuously along the ridge by relatively scanning the laser beam 4 in the ridge direction; and thus, chamfering is carried out separating the ridge from the glass substrate 1. |
