发明名称 SYNTHETIC RESIN MOLDING DIE STRUCTURE FOR ANTENNA
摘要 PROBLEM TO BE SOLVED: To mechanically mold synthetic resin of uniform wall thickness on the outer periphery of an antenna element by moving an auxiliary synthetic resin molding means by the pressure generated by the injection of synthetic resin injecting synthetic resin into a space formed on the periphery of a wire and forming a uniform protective cover on the outer periphery of the wire. SOLUTION: A movable mold 1 is brought into contact with a fixed mold 2 by a synthetic resin molding machine, and an antenna element 3 is retained in parallel with the contact faces of the movable mold 1 and the fixed mold 2. Synthetic resin in the contact state is pressed through a runner 11 and a gate 12 and injected while pressure is applied into a space in the mold. A ring 7 in the mold is moved while the ring 7 is pushed up by the pressure of the injected synthetic resin, and injected into the space thus formed. As a result, the upper end of a sleeve 8 integrated with the ring 7 is moved forward until being brought into contact with a stopper 14 of the movable mold 1, and a synthetic resin cover of the same diameter of the ring 7 is formed on the outer periphery of a wire 5 of the antenna element 3.
申请公布号 JPH09225946(A) 申请公布日期 1997.09.02
申请号 JP19970030440 申请日期 1997.02.14
申请人 HITACHI DENSHI LTD 发明人 SATO ICHIRO;SAKAMOTO KOJI
分类号 B29C33/12;B29C45/14;B29L31/00;H01Q1/12;H01Q1/40;(IPC1-7):B29C33/12 主分类号 B29C33/12
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