| 摘要 |
PROBLEM TO BE SOLVED: To reduce a size of the device and simplify the device by arranged a beam emitting substrate movable, which is arranged with a part to transduce a beam for machining to a beam in the visible region, between a light source and substrate to be machined. SOLUTION: In the device by which a beam from a machining beam source of KrF laser, etc., is condensed by an object lens 4 and a sample 5 is irradiated with the beam and machining is executed, a beam emitting substrate, which has a part coated with sodium salicylate to transducer an ultraviolet ray from a light source 1 to a beam in the visible region as fluorescence and a part to transmit a beam from the light source 1 as it is, arranged between the light source 1 and sample 5 through a XY stage 7 movable. In executing optical machining, the sample 5 is irradiated with the transduced beam in the visible region, after the reflected beam is received by and image sensor 6 through a beam splitter 3 and positioned for a machining position, beam is transmitted by moving the beam emitting substrate 2 and the sample 5 is machined. |
