发明名称 Semiconductor memory device having high speed parallel transmission line operation and a method for forming parallel transmission lines
摘要 A semiconductor memory device has the skew between the individual transmission lines of a parallel transmission bus minimized by the addition of respective load transmission lines to each of the individual transmission lines in the parallel bus. A first circuit unit including a first parallel bank of internal circuits for generating internal control signals is formed adjacent to a predetermined region within a chip. A second circuit unit includes a second parallel bank of internal circuits for performing a predetermined operation in response to an output of the first circuit unit. The second circuit transmits signals to the first circuit over a parallel bus comprised of a plurality of transmission lines connected respectively between the individual internal circuits of the first and second circuit units. A plurality of load transmission lines are connected respectively to predetermined portions of the individual transmission lines to thereby equalize the loads of the transmission lines.
申请公布号 US5663913(A) 申请公布日期 1997.09.02
申请号 US19960638373 申请日期 1996.04.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, HO-CHEOL;JANG, HYUN-SOON
分类号 G11C11/41;G11C7/22;G11C11/409;H01L21/8242;H01L27/108;(IPC1-7):G11C7/00 主分类号 G11C11/41
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