发明名称 TREATMENT OF WASTE PRINTED CIRCUIT BOARD MOUNTED WITH ELECTRONIC PARTS
摘要 <p>PROBLEM TO BE SOLVED: To seal the residue of heavy metals such as solder in a glass solid body in the treatment of a waste printed circuit board mounted with electronic parts. SOLUTION: After a waste printed circuit board mounted with electronic parts is crushed and resin is recovered as decomposed oil, the thermally decomposed residue is classified into glasses, metal copper and a residue containing other heavy metals. In a process in which the glasses are heated and melted and cooled and solidified, the residue containing heavy metals is thrown in and is sealed in glass after the heavy metals are converted into oxides in advance. In this way, the residue of heavy metals such as lead and tin is sealed in a glass solid body and is made harmless.</p>
申请公布号 JPH09225445(A) 申请公布日期 1997.09.02
申请号 JP19960040922 申请日期 1996.02.28
申请人 HITACHI LTD 发明人 ARATO TOSHIAKI;KOSEKI YASUO;YAMADA RYOKICHI;KANEKO TOMOKO
分类号 A62D3/00;B09B5/00;C22B7/00;H05K3/22;(IPC1-7):B09B5/00 主分类号 A62D3/00
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