发明名称 |
Multilayer printed wiring board and method of making same |
摘要 |
A multilayered printed wiring board includes two or more layers each having a via hole therein, these holes aligned vertically above one another to minimize board real estate while assuring an effective circuit path between respective points on the two layers. One or both via holes can be filled with either an electrically conductive material (e.g., copper paste) or a non-conductive material (e.g., resin).
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申请公布号 |
US5662987(A) |
申请公布日期 |
1997.09.02 |
申请号 |
US19960595063 |
申请日期 |
1996.02.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MIZUMOTO, SHOGO;TSUKADA, YUTAKA |
分类号 |
H05K3/40;H05K1/11;H05K3/00;H05K3/10;H05K3/42;H05K3/46;(IPC1-7):B32B9/00 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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