发明名称 Method of integrating electronic components into electronic circuit structures made using LTCC tape
摘要 The present invention provides a method of producing a low temperature cofired electronic monolithic structure having one or more electronic components integrated therein comprising the steps of: A. providing a green electronic component; B. providing a stack of green low temperature cofired ceramic dielectric tape having an opening formed in the stack for receiving the green electronic component; C. placing the green electronic component in the opening in the stack to form a structure; and D. laminating and firing the structure so as to provide the monolithic electronic structure.
申请公布号 US5661882(A) 申请公布日期 1997.09.02
申请号 US19950497239 申请日期 1995.06.30
申请人 FERRO CORPORATION 发明人 ALEXANDER, JOHN H.
分类号 H01L21/48;H01L23/498;H01L23/538;H05K1/03;H05K1/16;H05K1/18;(IPC1-7):H01G4/12 主分类号 H01L21/48
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