发明名称 |
Method of integrating electronic components into electronic circuit structures made using LTCC tape |
摘要 |
The present invention provides a method of producing a low temperature cofired electronic monolithic structure having one or more electronic components integrated therein comprising the steps of: A. providing a green electronic component; B. providing a stack of green low temperature cofired ceramic dielectric tape having an opening formed in the stack for receiving the green electronic component; C. placing the green electronic component in the opening in the stack to form a structure; and D. laminating and firing the structure so as to provide the monolithic electronic structure.
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申请公布号 |
US5661882(A) |
申请公布日期 |
1997.09.02 |
申请号 |
US19950497239 |
申请日期 |
1995.06.30 |
申请人 |
FERRO CORPORATION |
发明人 |
ALEXANDER, JOHN H. |
分类号 |
H01L21/48;H01L23/498;H01L23/538;H05K1/03;H05K1/16;H05K1/18;(IPC1-7):H01G4/12 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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