| 摘要 |
The packaging includes a support (1) provided with contact pads (2) and which receives an IC (3) connected to the pads via gold wires (4). The whole structure is covered by a cast block of resin (5). In the liquid resin, microscopic spherical silica particles (7) are added in a ratio of e.g. 5% relative to the resin mass. The particles, which are randomly distributed throughout the resin mass, stop propagation of cracks which may appear in the resin block. |
