发明名称 Cathode sputtering apparatus - includes hollow cathode fixed to bottom of target on wall of vacuum chamber, uniform distribution diaphragm shielding bottom of target, and rotary substrate holding plate
摘要 <p>A device for coating substrates by cathodic sputtering comprises a hollow target (4) which is open towards the substrate (3). A dark space shield (7) extends parallel to the side walls of the target (4) and a basic cathode (11) which is secured to the bottom (8) of the target is supported at the vacuum chamber wall (10) via an insulator (9) and is electrically connected to a power source (6). A holder (15) for a diaphragm (16) extends through a central opening (30) in the bottom of the target and in the bottom of the basic cathode body (11) and is insulated against the basic cathode body and the target. The holder shields the bottom part (8) of the of the target. A rotatably mounted, motor driven rotary plate (18) forms the substrate holder(17) and has an axis of rotation which extends parallel to the plane of symmetry (20) of the hollow target.</p>
申请公布号 DE19609248(A1) 申请公布日期 1997.08.28
申请号 DE1996109248 申请日期 1996.03.09
申请人 BALZERS PROZES-SYSTEME GMBH, 63450 HANAU, DE 发明人 SCHERER, MICHAEL, DR., 63517 RODENBACH, DE
分类号 C23C14/50;H01J37/34;(IPC1-7):H01J37/34;H05H1/46;C23C14/22;G11B5/68 主分类号 C23C14/50
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