| 摘要 |
<p>The present invention relates to a thermally conductive device (1) which is intended to establish mechanical and thermal contact between a first body (2), such as an electric and/or electronic circuit, and a second body (31), such as a cooling body, for the purpose of smoothing-out a temperature gradient occurring between the first and the second body. The device includes a first and a second contact pad (11, 12) and an element (13) acting therebetween. The first contact pad (11) is adapted for coaction with the first body (2) and the second contact pad (12) is adapted for coaction with the second body (31). The element (13) has at least one region (63a) that has a specific bending resistance. The region or region-proximate parts have a thermal conductance which is slightly lower than the thermal conductance of the regions located adjacent the region-proximate parts.</p> |
