发明名称 |
LOW THERMAL CONDUCTIVITY IN-MOLD LABEL FILMS |
摘要 |
<p>The invention is an in-mold label film comprising at least two layers with one layer being a heat seal layer (12) for bonding the film to a polymer substrate wherein the film has a thermal conductivity of less than about 1.250 x 10-4 kcal/sec cm ~C. The invention further includes a process for in-mold labeling comprising the steps of forming a label comprising at least two layers with one layer being a heat seal layer (12) for bonding the film to a plastic substrate wherein the film has a thermal conductivity of less than about 1.250 x 10-4 k-cal/sec cm ~C inserting the label into a mold for producing the plastic substrate with an inside and outside surface thereafter forming a plastic substrate in the mold with sufficient heat wherein the outside surface of the substrate bonds with the heat seal layer (12) of the label.</p> |
申请公布号 |
CA2247511(A1) |
申请公布日期 |
1997.08.28 |
申请号 |
CA19972247511 |
申请日期 |
1997.02.04 |
申请人 |
AVERY DENNISON CORPORATION |
发明人 |
BALAJI, RAMABHADRAN;POLASKY, MARK E. |
分类号 |
G09F3/02;B29C45/14;B29C47/00;B29C49/24;B29C51/12;B29C51/16;B29C55/02;B32B7/00;B32B27/08;B65D23/00;C08J5/18;G09F3/04;(IPC1-7):G09F3/10;B29C33/14 |
主分类号 |
G09F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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