发明名称 Wave soldering machine with wave contact angle adjustment
摘要 In a wave soldering machine, the solder reservoir (5) can turn about an axis (8) lying in the region which is provided for the crest of the solder wave (7) and which extends transversely to the workpiece transport direction. Preferably, the workpiece transport device (3) has a constant slope and position relative to the machine housing (2). Preferably, the transport device (3) can be moved independently of the housing (2) and is inclined at an adjustable angle (13) of 0-20 (preferably 6-10) deg to the horizontal. The housing (2) and the solder reservoir (5) preferably have no contact points. The machine may be provided with equipment (9) for creating a protective gas atmosphere for excluding oxygen above the solder reservoir (5) or for creating a reduced pressure in the housing (2).
申请公布号 DE19606850(A1) 申请公布日期 1997.08.28
申请号 DE19961006850 申请日期 1996.02.23
申请人 LINDE AG, 65189 WIESBADEN, DE;EPM HANDELS AG, ZUERICH, CH 发明人 WANDKE, ERNST, DIPL.-ING. DR.-ING.HABIL., 82538 GERETSRIED, DE;ISLER, HANS, WIDEN, CH
分类号 B23K3/06;(IPC1-7):B23K3/00;H05K3/34 主分类号 B23K3/06
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