Halbleiterchip und Verfahren zu seiner Herstellung

摘要

A power supply wiring arrangement of a semiconductor integrated circuit formed on a semiconductor chip (40), characterized by a) a plurality of pairs of metal bumps (44) formed on the semiconductor chip (40), b) a plurality of conductor strips (50) each extending between the bumps forming each of said pairs of metal bumps (44), and c) a plurality of thick-layer wiring strips (48) directly connected to selected ones of said metal bumps (44) and said conductor strips (50), said thick-layer wiring strips being substantially identical in material and in thickness to said metal bumps (44). o