| 摘要 |
<p>PURPOSE: To provide a semiconductor wafer holding device which does not damage the main surface of a semiconductor wafer and has a strong holding force by providing a first sucking section which sucks one main surface of the wafer, second sucking section which sucks the other main surface of the wafer, and a specific supporting section which elastically connects both sucking sections to each other. CONSTITUTION: A semiconductor wafer holding device is provided with a first sucking section 1 which sucks one main surface of a wafer, second sucking sections 2 which sucks the other main surface of the wafer, and a supporting section 8 which has a route 13 for passing a suction air for sucking the wafers in its body and elastically connects both sections 1 and 2 to each other at a prescribed interval. For example, the sections 1 and 2 are respectively provided with suction ports 12 and suction paths 11 and 11' and the supporting section 8 is provided with a mobile section 9 which is moved in the direction in which the section 9 is separated from the side faces of the wafer by the suction pressure. The section 9, in addition, is made to make elastic movement in the direction in which the sections 1 and 2 are brought nearer to each other by the suction pressure.</p> |
