Method of manufacturing semiconductor elements with active structures

摘要

The manufacturing method has a number of semiconductor elements (2) with active structures (3) formed in the surface of a semiconductor wafer (1) immediately adjacent one another. Each semiconductor element has a surface area which is greater than that of the active structure, with several identical active structures formed within each semiconductor element.Only one active structure is contacted by the semiconductor element, the physical parameters of the active structures measured to determine which active element is contacted.