Power semiconductor module

摘要

A power semiconductor module having a power circuit unit; a metal base (11) for sealing the bottom of the module; an insulation substrate (14) for electrically insulating between the metal base (11) and the power circuit unit; external input and output terminals (12) connected to the power circuit unit; a resin case (10) in which the external input and output terminals (12) are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provisions of an inserted nut (13) for fastening the external input and output terminals (12) with a screw; an inserted metal base (11), both being inserted in the resin case (10) by integral molding; and a recess (1C) of the screw immediately below the inserted nut (13), the recess without penetrating the resin case (10), and the metal base (11) extending below the recess.