| 摘要 |
PURPOSE:To provide a production process of a printed wiring board having end face through-holes having a high connection reliability, without having burr or peel of a Cu-plated layer or drops of lands. CONSTITUTION:A laminate board having Cu layers on both sides is composed of a board made of only a resin not contg. by glass cloth. Through-holes are formed in specified portions on this laminate board and Cu paste 3 is charged in these holes enough to fill them. After forming a circuit pattern on the surface of the board 5, a plating resist pattern is formed on the board, leaving the circuit pattern region and surface of the paste 3. After forming a thin Cu plated layer, the plated resist pattern is removed. Then, the exposed part of the board 5 is removed by the plasma etching method, using this Cu plated layer as a metal resist. Finally, the Cu plated layer is removed to form end face through- holes. |
