| 摘要 |
<p>PURPOSE: To provide the flip chip mounting method of mounted semiconductor element hardly releasing from a substrate capable of cutting down soldering step as well as the bonding agent used for this mounting method. CONSTITUTION: A filmy bonding agent 3 having upheaped central part is pressure-fixed downward on a substrate 1 having substrate pads 2. Next, a semiconductor element 4 whereon a bump 5 is formed is overlapped with a substrate 1 so that the substrate pads 2 and the bumps 5 may be brought into contact with one another to make the semiconductor element 4 pressure-fix to the bonding agent 3 through the bump 5. Besides, the substrate pads 2 and the bumps 5 are electrically connected by this pressure-fixing step. Finally, the whole body is externally heated to melt down and fix the bonding agent so as to mechanically connect the substrate 1 to the semiconductor element 4.</p> |
