| 摘要 |
PURPOSE:To eliminate danger of explosion, and enable continuos processing of large area, by reducing copper oxide on a copper layer surface by using plasma formed under pressure aproximate to atmospheric pressure wherein reducing gas is introduced. CONSTITUTION:In order to increase the adhesion of prepreg 22, many fine protrusions of copper oxide are formed on a copper layer surface by oxidation, and then returned to copper by reduction. In the reaction vessel which is used for reducing copper oxide, two planar electrodes, an upper electrode 2 and a lower electrode 3, are arranged parallel with each other so as to keep a specified distance, and solid dielectric 6 is put on the surface of the lower electrode 3. The solid dielectric 6 obstructs generation of arc discharge, and generates glow discharge continuously. An object 4 to be processed is arranged between the upper electrode 2 and the lower electrode 3. In the case of processing, inert gas containing reducing gas is introduced from a gas feeding port 11, and AC power is supplied by operating an AC power supply 5. Thereby plasma is generated between the electrodes 2 and 3, and copper oxide on the surface of the object 4 to be processed is reduced and returned to copper. |
