SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which solder bumps can be suitably formed when a semiconductor chip is integrally formed with a film substrate to change an array pattern of the bumps of the semiconductor chip. SOLUTION: A film substrate 21 is bonded to a semiconductor chip 27 at the center of its upper surface via a pressure sensitive adhesive double coated film 29. Second connecting electrodes 24 are contacted with bumps 28 on the semiconductor chip 27. Solder bumps 26 are formed on first connecting electrodes 23. When the solder bumps 26 are formed, solder balls are positioned on the respective first connecting electrodes 23 and then subjected to a wet-back process. In this case, the solder balls can be positioned as directly contacted with the first connecting electrodes 23 and eventually the solder bumps 26 can be suitably formed.