HOLLOW RING, MANUFACTURE THEREOF AND SEMICONDUCTOR PACKAGE USING THE RING

摘要

PROBLEM TO BE SOLVED: To provide a hollow ring which is manufactured by powder metallurgy used for chip package at low cost with less warpage and also to provide a semiconductor package using the ring. SOLUTION: In the semiconductor package including a mounting region for mounting of a semiconductor chip thereon and a hollow ring for surrounding the semiconductor chip and its periphery; the hollow ring is made of metal composite material of copper and molybdenum obtained by mixing and sintering copper and molybdenum. The copper/molybdenum metal composite material substantially contains 20-80wt.% of copper, 0.1-0.5wt.% of one or both of iron and manganese and a balance of molybdenum, and has a true density ratio of 98% or more. The hollow ring has a parallelism of±1.5/100 or less of its upper and lower surface perpendicular to its hollow part, a hardness Hv of 110 or more and a thermal conductivity of 1-10W/m.K or more.