发明名称 Thin film device and a method for fabricating the same
摘要 A thin film device includes a substrate, a conductive oxide film formed on the substrate, and a metal film formed on the substrate and in contact with at least a part of the conductive oxide film. The metal film includes aluminum and a metallic material. The metallic material has a standard electrode potential higher than the standard electrode potential of the aluminum so that the standard electrode potential of the metal film is higher than the reduction potential of the conductive oxide film.
申请公布号 US5660971(A) 申请公布日期 1997.08.26
申请号 US19960632637 申请日期 1996.04.15
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KOBAYASHI, IKUNORI;ISHIHARA, SHINICHIRO;OKAFUJI, MICHIKO
分类号 G02F1/136;G02F1/1362;G02F1/1368;H01L21/28;H01L21/336;H01L29/40;H01L29/45;H01L29/78;H01L29/786;(IPC1-7):G03F7/30;G03F7/11 主分类号 G02F1/136
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