SEMICONDUCTOR DEVICE AND A PRINTED CIRCUIT BOARD FOR MOUNTING IT

摘要

PROBLEM TO BE SOLVED: To enable formation of more signal wiring lines by taking the arrangement of through holes into consideration and using an existing inexpensive wiring-line formation process in wiring-line design of a ball grid array(BGA) package and a printed circuit board for mounting the package thereon. SOLUTION: In the plastic BGA package having 400 pins, a BGA board is provided on its rear side with solder ball connecting pads 2 which in turn are connected to through-holes 4 through wiring lines 3. The through holes 4 are connected to wiring lines formed on a front surface of the BGA board 1, and thus are connected to a semiconductor chip 7 from the wiring lines via bonding wires. The solder ball connecting pads 2 are arranged by 4 turns along the outer periphery of the rear side of the BGA board 1. With respect to the innermost turn of the pads 2, the associated through-holes 4 are arranged in a zigzag form as distributed alternately along its inner and outer side lines of the pads on every other through-hole basis.